Universität zu Köln

Muller, Carola J., Bushlya, Volodymyr ORCID: 0000-0002-6955-4613, Ghasemi, Masoomeh ORCID: 0000-0001-5296-757X, Lidin, Sven ORCID: 0000-0001-9057-8233, Valldor, Martin and Wang, Fei (2015). Ternary intermetallic compounds in Au-Sn soldering systems-structure and properties. J. Mater. Sci., 50 (23). S. 7808 - 7821. NEW YORK: SPRINGER. ISSN 1573-4803

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Abstract

The intermetallic compound AuSn is essential for the wetting of Au-rich AuSn solders. On the addition of In or Sb, pseudo-binary compounds AuSn1-x In (x) (x a parts per thousand currency sign 0.33) and AuSn1-y Sb (y) (y a parts per thousand currency sign 0.17) are formed. Both adopt the AuSn structure type (P6(3)/mmc, Z = 2). This single-crystal X-ray diffraction study reveals that there is an absence of superstructure ordering upon long-time annealing (years). This behavior constitutes a surprising contrast to the related compounds in the systems Cu-In-Sn and Cu-Sn-Sb. As subsequent total energy calculations disclose, superstructure ordering is neither expected at 0 K nor by the application of high pressure. Hence, decomposition to AuSn and its neighboring phases in the ternary phase diagrams is the only way to release chemical pressure quickly. However, the ternary phases are formed at the expense of the binary compound AuSn, when moving away from the ideal composition. To give an idea how additions of In and Sb will affect the performance of AuSn in the solder joint, we studied the physical properties such as magnetism and resistance as well as mechanical properties such as hardness, elastic modulus, and fracture behavior.

Item Type:	Journal Article
Creators:	Creators Email ORCID ORCID Put Code Muller, Carola J. UNSPECIFIED UNSPECIFIED UNSPECIFIED Bushlya, Volodymyr UNSPECIFIED orcid.org/0000-0002-6955-4613 UNSPECIFIED Ghasemi, Masoomeh UNSPECIFIED orcid.org/0000-0001-5296-757X UNSPECIFIED Lidin, Sven UNSPECIFIED orcid.org/0000-0001-9057-8233 UNSPECIFIED Valldor, Martin UNSPECIFIED UNSPECIFIED UNSPECIFIED Wang, Fei UNSPECIFIED UNSPECIFIED UNSPECIFIED
URN:	urn:nbn:de:hbz:38-386618
DOI:	10.1007/s10853-015-9352-y
Journal or Publication Title:	J. Mater. Sci.
Volume:	50
Number:	23
Page Range:	S. 7808 - 7821
Date:	2015
Publisher:	SPRINGER
Place of Publication:	NEW YORK
ISSN:	1573-4803
Language:	English
Faculty:	Unspecified
Divisions:	Unspecified
Subjects:	no entry
Uncontrolled Keywords:	Keywords Language LEAD-FREE SOLDERS; CRYSTAL-STRUCTURES; ELASTIC-MODULUS; HARDNESS; SUPERSTRUCTURE; INDENTATION; ALLOYS; TIN Multiple languages Materials Science, Multidisciplinary Multiple languages
URI:	http://kups.ub.uni-koeln.de/id/eprint/38661